Multilayer PCB

Original
price: Negotiable
minimum:
Total supply:
Delivery term: The date of payment from buyers deliver within days
seat: Beijing
Validity to: Long-term effective
Last update: 2022-12-06 20:36
Browse the number: 136
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Product details

HASL: Hot air solder spraying is a step and process flow in the production process of multilayer PCB. Specifically, immerse the PCB into the molten solder pool, so that all exposed copper surfaces will be covered by solder, and then remove the excess solder on the PCB through a hot-air cutter. Because the surface of the circuit board after tin spraying is the same material as the solder paste, the welding strength and reliability are good. However, due to its processing characteristics, the surface flatness of tin spraying treatment is not good, especially for small electronic components such as BGA. Due to the small welding area, if the flatness is poor, it may cause problems such as short circuit. Therefore, a process with good flatness is needed to solve the problem of tin spraying plate. Generally, the gold plating process will be selected (note that it is not the gold plating process), and the principle and method of chemical replacement reaction will be used for reprocessing to increase the nickel layer with a thickness of about 0.03 ~ 0.05um or 6um to improve the surface flatness.


PCB Standard: IPC-A-610 D


Supply Ability
500000 Piece/Pieces per month


Packaging & Delivery
Packaging Details
PCB: Vacuum Packing with Carton Box 
PCBA: ESD Packing with Carton Box
Shipping service: By EMS/DHL/FEDEX/UPS/SEA
Port: ShangHai  
Payment Method: T/T; Paypal; Western Union; MoneyGram
Product cost:  0.1 USD-8 USD 


Product Description
The biggest difference between Multilayer PCB and single-panel and double-panel is that the internal power layer (maintaining the internal electrical layer) and ground layer are added. The power and ground networks are mainly routed on the power layer. However, the multilayer board wiring is mainly based on the top and bottom layers, supplemented by the middle wiring layer. Therefore, the design method of the multi-layer board is basically the same as that of the double-sided board. The key lies in how to optimize the wiring of the inner electrical layer, so that the wiring of the circuit board is more reasonable and the electromagnetic compatibility is better.


1: Support 48 hours make the sample, In general, smaples need 3-5 working days, mass production need 8-12 working days.
2. MOQ is 1 PCS. produce rigid FR4,1-48 layer PCB.
3. Mini Line width / space:0.15mm, Minin drill holes:0.3mm
4. Pass through ISO9001/SGS/ROHS certificate
5. Support OEM design, Send us gerber file.



Application:

http://www.rcpcba1s.com/

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